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materials for electric and electronics engineering, Lecture notes of Material Engineering

thermal properties for materials

Typology: Lecture notes

2018/2019

Uploaded on 09/23/2019

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Chapter 19 - 1
ISSUES TO ADDRESS...
• How does a material respond to heat?
• How do we define and measure...
-- heat capacity
-- coefficient of thermal expansion
-- thermal conductivity
-- thermal shock resistance
• How do ceramics, metals, and polymers rank?
Chapter 19:
Thermal Properties
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ISSUES TO ADDRESS...

  • How does a material respond to heat?
  • How do we define and measure...

-- heat capacity

-- coefficient of thermal expansion

-- thermal conductivity

-- thermal shock resistance

  • How do ceramics, metals, and polymers rank?

Chapter 19:

Thermal Properties

- General: The ability of a material to absorb heat.

  • Quantitative: The energy required to increase the

temperature of the material.

heat capacity

(J/mol-K)

energy input (J/mol)

temperature change (K)

Heat Capacity

- Two ways to measure heat capacity:

C

p

: Heat capacity at constant pressure.

C

v

: Heat capacity at constant volume.

C

p

C

v

  • Specific heat has typical units of

kg K

J

dT

dQ

C 

Specific heat means heat capacity per unit mass!

- Heat capacity...

-- increases with temperature

-- reaches a limiting value of 3 R

  • Atomic view:

-- Energy is stored as atomic vibrations.

-- As T goes up, so does the avg. energy of atomic vibr.

Heat Capacity vs T

Adapted from Fig. 19.2,

Callister 7e.

gas constant

3 R

= 8.31 J/mol-K

C

v

= constant

Debye temperature

(usually less than T room

T (K)

D

0

0

C v

increasing

c

p

- Why is cp significantly

larger for polymers?

Selected values from Table 19.1, Callister 7e.

- Polymers

Polypropylene

Polyethylene

Polystyrene

Teflon

c p

(J/kg-K)

at room T

- Ceramics

Magnesia (MgO)

Alumina (Al 2

O

Glass

- Metals

Aluminum

Steel

Tungsten

Gold

c p

: (J/kg-K)

C

p

: (J/mol-K)

material

Heat Capacity: Comparison

Chapter 19 - 7

Energy Storage

  • Other small contributions to energy storage - (^) Electron energy levels - (^) Dominate for ceramics & plastics - (^) Energy storage in vibrational modes

Adapted from Fig. 19.3,

Callister 7e.

No change!

Thermal Expansion: Comparison

- Q: Why does

generally decrease

with increasing

bond energy?

Polypropylene 145-

Polyethylene 106-

Polystyrene 90-

Teflon 126-

  • Polymers

at room T

  • Ceramics

Magnesia (MgO) 13.

Alumina (Al 2

O

3

Soda-lime glass 9

Silica (cryst. SiO 2

  • Metals

Aluminum 23.

Steel 12

Tungsten 4.

Gold 14.

(

/K) Material

Selected values from Table 19.1, Callister 7e.

Polymers have smaller

 

because of weak

secondary bonds

  • General: The ability of a material to transfer heat.
  • Quantitative: temperature

gradient

thermal conductivity (J/m-K-s)

heat flux

(J/m

2 -s)

  • Atomic view: Atomic vibrations in hotter region carry

energy (vibrations) to cooler regions.

T

> T

T

x

x

heat flux

Thermal Conductivity

dx

dT

q  k

Fourier’s Law

STEADY STATE => q, heat flux does NOT change with time

k T

= k l

  • k e

Thermal Conductivity: Comparison

increasing k

- Polymers

Polypropylene 0.

Polyethylene 0.46-0.

Polystyrene 0.

Teflon 0.

By vibration/

rotation of chain

molecules

- Ceramics

Magnesia (MgO) 38

Alumina (Al 2

O

3

Soda-lime glass 1.

Silica (cryst. SiO 2

By vibration of

atoms

- Metals

Aluminum 247

Steel 52

Tungsten 178

Gold 315

By vibration of

atoms and

motion of

electrons

Material k (W/m-K) Energy Transfer

Selected values from Table 19.1, Callister 7e.

  • Occurs due to: uneven heating/cooling.
  • Ex: Assume top thin layer is rapidly cooled from T 1

to T

2

Tension develops at surface

( ) 1 2

 ETT

Critical temperature difference

for fracture (set  = f)

E

T T

f

1 2 fracture

set equal

  • Large thermal shock resistance when is large.

E

k f

  • Result:

E

k f

for fracture

(quenchrate)

Thermal Shock Resistance

Temperature difference that

can be produced by cooling:

k

T T

quench rate

1 2

rapid quench

resists contraction

tries to contract during cooling

T

2

T

1

Chapter 19 - 14

  • Application:

Space Shuttle Orbiter

  • Silica tiles (400-1260C):

--large scale application --microstructure:

Fig. 19.2W, Callister 6e. (Fig. 19.2W adapted from L.J.

Korb, C.A. Morant, R.M. Calland, and C.S. Thatcher, "The

Shuttle Orbiter Thermal Protection System", Ceramic

Bulletin , No. 11, Nov. 1981, p. 1189.)

Fig. 19.3W, Callister 5e. (Fig. 19.3W courtesy the

National Aeronautics and Space Administration.)

Fig. 19.4W, Callister 5e. (Fig. 219.4W courtesy

Lockheed Aerospace Ceramics

Systems, Sunnyvale, CA.)

Thermal Protection System

reinf C-C

(1650°C)

Re-entry T

Distribution

silica tiles

(400-1260°C)

nylon felt, silicon rubber

coating (400°C)

~90% porosity!

Si fibers

bonded to one

another during

heat treatment.

100 m

Chapter-opening photograph, Chapter 23, Callister 5e

(courtesy of the National Aeronautics and Space

Administration.)

Core Problems:

Self-help Problems:

ANNOUNCEMENTS

Reading: