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Chemical Vapor Deposition - Thin Film Materials Processing - Lecture Slides, Slides of Material Engineering

These are the Lecture Slides of Thin Film Materials Processing which includes Vaporization, Vapor Pressure Curves, Thermal Desorption, Molecular Binding Energy, First Order Desorption, Desorption Rate, Real Surfaces, Diffusion of Gas Particles etc. Key important points are: Chemical Vapor Deposition, Degree of Crystallinity, Growth Kinetics, Stagnant Film Model, Boundary Layer Theory, Gas Transport, Surface Reaction, Frequency Factor, Activation Energy

Typology: Slides

2012/2013

Uploaded on 03/21/2013

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Chemical Vapor Deposition
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Chemical Vapor Deposition

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Chemical Vapor Deposition

ƒ Chemical Vapor Deposition - a

technique for depositing thin film of

materials on wafers or other

substrates. Source gases are

introduced into a reaction chamber

and energy is applied through heat,

plasma generation, or other

techniques that result in the

decomposition of the source gas

and reaction the chemicals to form a

film.

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Degree of Crystallinity

ƒ Amorphous - no recognizable long range order to the positioning of atoms within the material

ƒ Polycrystalline (poly) - intermediate case, crystalline subsections that are disjoint relative to each other

ƒ Crystalline (epitaxial) - atoms are arranged in an orderly three- dimensional array

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5-Step CVD Process

GAS Flow

adsorbate

or

adatom

Substrate

weak e-

Reactants

Products

Stagnant

layer

ƒ 1 Diffusion across stagnant layer

ƒ 2 Adsorption on surface

ƒ 3 Surface reaction, migration film formation

ƒ 4 Desorption of Products

ƒ 5 Diffusion of products back into gas stream

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Growth Kinetics - Stagnant Film Model

original silicon surface

F

Cs

Cg

Main Gas Flow

s

Diffusion flow

Stagnant Layer

Gas Stream^ (linear gradient)

Epi Growth Wafer

F

Cs - Surface reactant concentration D = Diffusivity

Cg - Gas stream reactant concentration

surface reaction flow

F1 = D ( Cg - Cs ) s

Diffusivity times the concentration gradient

D

s

= hg = gas phase mass transfer coefficient

F1 = hg (Cg - Cs ) (^) F2 = Ks C (^) s For steady state Epitaxial Growth

F1 = F Therefore Cs = hg Cg Ks + hg^ F1 > F2 reaction limited F1 < F2 mass transport limited

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Gas Transport -- Boundary Layer Theory

ƒ Fluid Mechanics of Gas Flows

ƒ Gas moving down a tube of diameter d in the x

direction at a velocity v

ƒ A diffusion boundary layer s(x) is formed whose

thickness increases as the gas moves down the

tube

2

1

v

x

x

η = the gas viscosity

ρ = the gas mass density

v = gas stream velocity

diffusion boundary layer δ (x)

wafers

reactor chamber

d (^) v MAIN GAS FLOW

x Graphite Susceptor

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